Four 0.5A and 1.0A schottky diodes in space-saving chip-scale packages (CSPs), smaller and more efficient than typical industry-standard devices, have been developed by power management technology provider International Rectifier Corp. (IR), El Segundo CA.
Targeted at handheld, portable equipment where space is crucial, they use FlipKY CSP packaging technology. Applications include current steering, ORing, boost and freewheeling circuits.
30-volt IR0530CSP and 40-volt IR05H40CSP are 0.5A devices housed in a compact three-bump CSP that occupies 1.1mm2 of board space and has a profile of less than 0.6mm. Compared to industry-standard SOD-123-packaged schottky diodes, they occupy 80% less board space and operate up to 40% cooler, IR says.
30-volt IR130CSP and 40-volt IR1H40CSP are 1A BGA devices, occupying 2.3mm2 of board space, or about one third of the area consumed by a JEDEC DO-216AA package, yet deliver similar electrical and thermal performance.
“As handheld, portable devices continue to shrink while their functionality grows, the need for smaller power management components increases,” John Lambert, IR Product Marketing Engineer, says. “IR’s FlipKY product family delivers devices that are smaller and thinner, helping designers meet the demand of their product development roadmaps.”
FlipKY chip-scale packaging eliminates the lead frame, epoxy and mold compound traditionally used in other device packages and provides all electrical connections on one side of the silicon. This not only minimizes board space and device profile, IR says, but also reduces parasitic inductance.
In high frequency switching applications, such as boost converters for LCD displays or LED drives, lower parasitic inductance reduces voltage spikes and switching noise, which improves electrical efficiency and reduces EMI.
The large bumps of the 0.5A devices also serve as very efficient heat conduction paths to the PCB, enabling cooler operation than traditional leadframe devices. In addition, the packaging technology enables the parts to be assembled with standard SMT techniques.
